Fanless BoxPC EMS-TGL
Teito’s Industrial partner is unveiling the latest Tiger Lake UP3 fanless box PC EMS-TGL. Tiger Lake is the 11th Generation Intel® Core™ Processor Family for the Internet of Things (IoT) Applications. 11th Gen Intel® Core™ processors deliver a balance of performance and responsiveness in a low-power platform built on our third-generation 10nm process technology. The platform combines a high-performance CPU, up to 23% faster single-thread performance, and up to 19% faster multi-thread performance.
Exceptional System performance
Avalue EMS-TGL fanless box PC is adopted with the 11th Gen Intel® Core™ i3/i5/i7 processors and 2 x 260-pin SODIMM socket max. up to 64GB DDR4 3200 MT/s with just less than 15W TDP, is a low-power and high-performance Computing. EMS-TGL is equipped with a wide array of I/O interface, including 4 x USB3.1, 1 x DP, 1 x HDMI, 2 x COM, 2 x LAN, 1 x 8bit GPIO can also be added according to customers’ requirements, giving it high expandability. EMS-TGL also supports 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE. To meet 5G technology trend, EMS-TGL is able to provide high speed, low Latency, and multi-connections for IoT and AIOT related applications.
Advanced graphics, media, display performance
With new Intel® Iris® Xe graphics, the platform offers up to 2.95 times faster graphics performance, plus PCI Express* 4.0 and Thunderbolt™ 4/USB4. Compared with the 8th Gen Intel® Core™ processors with 24EU, 11th Gen Intel® Core™ processors got up to 96EU. With advanced graphics, media, and display performance, EMS-TGL supports applications like digital signage and smart retail (including AI-enhanced for analytics), as well as computer vision with inferencing capabilities for uses like network video recorders or machine vision and inspection.
Rugged structural design for under extreme environmental
The rugged structural design can withstand strong vibrations or impacts and operate normally under extreme weather conditions. To be a strong embedded system used in a harsh environment, EMS-TGL is given with several ruggedized features: metal chassis with an IP-50 rating, fanless operation with sufficient thermal solutions, passes anti-shock (5G) and anti-vibration (55G) test. Furthermore, wide operation temperature (0~70°C (ST)/ -40 ~70°C (WT)) and wide voltage (+9 ~ +32 V) input with anti-interference capability protect the computer from overload short circuits and guarantee a normal function system in demanding industrial applications.
IET Expansion modules for all kinds of applications
EMS-TGL supports an innovative IET (Intelligent Expansion Technology) interface which offers flexibility to integrate multiple I/O, or to develop the extension module following the project request.
EMS-TGL is engineered to deliver reliability applications, such as:
– Industrial/ Energy
– Office automation
– Public sector
– Vision systems
EMS-TGL main features:
– EMS-TGL main features:
– On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
– 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
– Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
– Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
– Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
– CE, FCC Class B, IP50
– Wide range DC power input from +9~32V
– Support HW TPM 2.0
– Support vPro